Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques

Wasley, T, Li, J, Kay, R et al. (6 more authors) (2016) Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques. In: Proceedings. 66th Electronic Components and Technology Conference (ECTC 2016), 31 May - 03 Jun 2016, Las Vegas, NV, USA. IEEE , pp. 849-856. ISBN 978-1-5090-1204-6

Abstract

Metadata

Authors/Creators:
  • Wasley, T
  • Li, J
  • Kay, R
  • Ta, D
  • Shephard, J
  • Stringer, J
  • Smith, P
  • Esenturk, E
  • Connaughton, C
Copyright, Publisher and Additional Information: © 2016 IEEE. This is an author produced version of a paper published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Uploaded in accordance with the publisher's self-archiving policy.
Keywords: Additive manufacturing; 3D printing; Flip-chip packaging; bespoke electronics; digitally driven fabrication
Dates:
  • Published: 18 August 2016
  • Accepted: 18 August 2016
  • Published (online): 18 August 2016
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds)
Funding Information:
FunderGrant number
Not AssignedEP/L017415/1
Depositing User: Symplectic Publications
Date Deposited: 21 Nov 2016 10:17
Last Modified: 01 Dec 2016 23:05
Published Version: https://doi.org/10.1109/ECTC.2016.187
Status: Published
Publisher: IEEE
Identification Number: https://doi.org/10.1109/ECTC.2016.187

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