Reactive material jetting of polyimide insulators for complex circuit board design

Zhang, F, Saleh, E, Vaithilingam, J et al. (5 more authors) (2019) Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25. pp. 477-484. ISSN 2214-7810

Abstract

Metadata

Authors/Creators:
  • Zhang, F
  • Saleh, E
  • Vaithilingam, J
  • Li, Y
  • Tuck, CJ
  • Hague, RJM
  • Wildman, RD
  • He, Y
Copyright, Publisher and Additional Information: © 2018 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/BY/4.0/)
Keywords: 3D print; Additive manufacturing; Printed electronics; Polyimide; Inkjet
Dates:
  • Accepted: 17 November 2018
  • Published (online): 22 November 2018
  • Published: January 2019
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 15 May 2019 10:03
Last Modified: 15 May 2019 10:05
Status: Published
Publisher: Elsevier B.V.
Identification Number: https://doi.org/10.1016/j.addma.2018.11.017

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