Lai, F., Qu, S., Duan, Y. et al. (6 more authors) (2018) The wear and fatigue behaviours of hollow head & sodium filled engine valve. Tribology International, 128. pp. 75-88. ISSN 0301-679X
Abstract
ncreasing performance of IC engines often leads to higher combustion temperatures causing premature failure of exhaust valves. This paper presents for the first time a tribological assessment of hollow head & sodium filled valves (HHSVs) produced using a new and novel manufacturing process. Tests were conducted on HHSVs using bespoke bench-top wear and fatigue apparatus and they survived defined durability tests. Compared to traditional solid valves; the highest temperature of the hollow stem & sodium filled valves decreased from 745 °C to 590 °C, the new design and manufacturing process did not adversely affect the classical wear mechanisms (e.g. oxidation accelerated adhesion) or the material loss magnitude, and the design of HHSVs gives a 16.1% reduction in mass.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2018 Elsevier. This is an author produced version of a paper subsequently published in Tribology International. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/). |
Keywords: | Hollow head engine valve; Wear testing; Fatigue behaviour; Wear mechanism |
Dates: |
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Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Mechanical Engineering (Sheffield) |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 25 Jul 2018 11:52 |
Last Modified: | 11 Aug 2020 11:14 |
Status: | Published |
Publisher: | Elsevier |
Refereed: | Yes |
Identification Number: | 10.1016/j.triboint.2018.07.015 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:133437 |
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Filename: Tribology Int 2018 Wear of Hollow and Sodium Filled Vales ARC.pdf
Licence: CC-BY-NC-ND 4.0