Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix

Bournias-Varotsis, A, Friel, RJ, Harris, RA orcid.org/0000-0002-3425-7969 et al. (1 more author) (2018) Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix. Journal of Manufacturing Processes, 32. pp. 664-675. ISSN 1526-6125

Abstract

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Authors/Creators:
Copyright, Publisher and Additional Information: Crown Copyright © 2018 Published by Elsevier Ltd on behalf of The Society of Manufacturing Engineers. This is an open access article under the CC BY license (http://creativecommons.org/licenses/BY/4.0/).
Keywords: Additive Manufacturing; 3D Printing; Embedded Electronics; Ultrasonic Additive Manufacturing; Ultrasonic Consolidation; Plastic Deformation
Dates:
  • Published: April 2018
  • Accepted: 22 March 2018
  • Published (online): 9 April 2018
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 12 Apr 2018 13:39
Last Modified: 09 Jul 2019 09:29
Status: Published
Publisher: Elsevier
Identification Number: https://doi.org/10.1016/j.jmapro.2018.03.027

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