Micro electronic systems via multifunctional additive manufacturing

Li, J, Wasley, T, Ta, D et al. (7 more authors) (2018) Micro electronic systems via multifunctional additive manufacturing. Rapid Prototyping Journal, 24 (4). pp. 752-763. ISSN 1355-2546

Abstract

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Authors/Creators:
Copyright, Publisher and Additional Information: © 2018, Emerald Publishing Limited . This is an author produced version of a paper published in Rapid Prototyping Journal. Uploaded in accordance with the publisher's self-archiving policy.
Keywords: Additive manufacturing; DLP stereolithography; Flip chip packaging; Material dispensing; Multilayer embedded electronics; Process integration
Dates:
  • Published: April 2018
  • Accepted: 15 June 2017
  • Published (online): 13 April 2018
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds)
Funding Information:
FunderGrant number
EPSRCEP/L017415/1
Depositing User: Symplectic Publications
Date Deposited: 03 Nov 2017 16:33
Last Modified: 24 Jul 2018 14:05
Status: Published
Publisher: Emerald
Identification Number: https://doi.org/10.1108/RPJ-02-2017-0033

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