Statistical analysis of stencil technology for wafer-level bumping

Kay, RW, Cummins, G, Krebs, T et al. (3 more authors) (2014) Statistical analysis of stencil technology for wafer-level bumping. Soldering & Surface Mount Technology, 26 (2). pp. 71-78. ISSN 0954-0911

Abstract

Metadata

Authors/Creators:
  • Kay, RW
  • Cummins, G
  • Krebs, T
  • Lathrop, R
  • Abraham, E
  • Desmulliez, M
Keywords: Interconnects, Pb-free, Solder joints, Stencil printing, Wafer-level package
Dates:
  • Published: April 2014
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 24 Mar 2017 12:37
Last Modified: 24 Mar 2017 12:37
Published Version: https://doi.org/10.1108/SSMT-07-2013-0017
Status: Published
Publisher: Emerald
Identification Number: https://doi.org/10.1108/SSMT-07-2013-0017

Download not available

A full text copy of this item is not currently available from White Rose Research Online

Share / Export

Statistics