Hybrid additive manufacturing of 3D electronic systems

Li, J, Wasley, T, Nguyen, TT et al. (7 more authors) (2016) Hybrid additive manufacturing of 3D electronic systems. Journal of Micromechanics and Microengineering, 26 (10). 105005. ISSN 0960-1317

Abstract

Metadata

Authors/Creators:
  • Li, J
  • Wasley, T
  • Nguyen, TT
  • Ta, VD
  • Shephard, JD
  • Stringer, J
  • Smith, P
  • Esenturk, E
  • Connaughton, C
  • Kay, R
Copyright, Publisher and Additional Information: © 2016 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Micromechanics and Microengineering. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0960-1317/26/10/105005. Uploaded in accordance with the publisher's self-archiving policy.
Dates:
  • Published: October 2016
  • Accepted: 28 June 2016
  • Published (online): 23 August 2016
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 21 Nov 2016 11:22
Last Modified: 27 Aug 2017 03:28
Published Version: https://doi.org/10.1088/0960-1317/26/10/105005
Status: Published
Publisher: IOP Publishing
Identification Number: https://doi.org/10.1088/0960-1317/26/10/105005

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