Additive Manufacturing of High Resolution Embedded Electronic Systems

Wasley, T, Li, J, Ta, D et al. (6 more authors) (2016) Additive Manufacturing of High Resolution Embedded Electronic Systems. In: Proceedings of the 27th Annual International Solid Freeform Fabrication Symposium – An Additive Manufacturing Conference. Solid Freeform Fabrication 2016 (SFF Symp 2016), 08-10 Aug 2016, Austin, Texas, USA. University of Texas at Austin , pp. 1838-1855.

Abstract

Metadata

Authors/Creators:
  • Wasley, T
  • Li, J
  • Ta, D
  • Shephard, J
  • Stringer, J
  • Smith, P
  • Esenturk, E
  • Connaughton, C
  • Kay, R
Keywords: additive manufacturing; process integration; multilayer embedded electronics; DLP stereolithography; material dispensing; flip chip packaging
Dates:
  • Published: 1 September 2016
  • Accepted: 15 July 2016
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds)
Funding Information:
FunderGrant number
EPSRCEP/L017415/1
Depositing User: Symplectic Publications
Date Deposited: 21 Nov 2016 11:45
Last Modified: 08 Oct 2017 16:44
Published Version: http://sffsymposium.engr.utexas.edu/TOC2016
Status: Published
Publisher: University of Texas at Austin

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