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Bleiker, S, Fischer, A, Shah, A et al. (6 more authors) (2015) High-aspect-ratio through silicon vias (TSVs) for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (1). 21 - 27. ISSN 2156-3950

This list was generated on Sun Jun 28 01:19:29 2020 BST.