Wu, Z, Li, X, Garraghan, PM et al. (3 more authors) (2016) Virtual Machine Level Temperature Profiling and Prediction in Cloud Datacenters. In: 2016 IEEE 36th International Conference on Distributed Computing Systems (ICDCS). IEEE International Conference on Distributed Computing Systems (ICDCS 2016), 27-30 Jun 2016, Nara, Japan. Institute of Electrical and Electronics Engineers (IEEE) , pp. 735-736. ISBN 978-1-5090-1483-5
Abstract
Temperature prediction can enhance datacenter thermal management towards minimizing cooling power draw. Traditional approaches achieve this through analyzing task-temperature profiles or resistor-capacitor circuit models to predict CPU temperature. However, they are unable to capture task resource heterogeneity within multi-tenant environments and make predictions under dynamic scenarios such as virtual machine migration, which is one of the main characteristics of Cloud computing. This paper proposes virtual machine level temperature prediction in Cloud datacenters. Experiments show that the mean squared error of stable CPU temperature prediction is within 1.10, and dynamic CPU temperature prediction can achieve 1.60 in most scenarios.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2016 IEEE. . Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Computing (Leeds) > Institute for Computational and Systems Science (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 25 May 2016 15:17 |
Last Modified: | 27 Jan 2018 17:04 |
Published Version: | https://dx.doi.org/10.1109/ICDCS.2016.62 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Identification Number: | 10.1109/ICDCS.2016.62 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:98903 |