Effective thermal conductivity of porous solder layers

Pritchard, L.S., Acarnley, P.P. and Johnson, C.M. (2004) Effective thermal conductivity of porous solder layers. IEEE Transactions on Components and Packaging Technologies, 27 (2). pp. 259-267. ISSN 1521-3331



  • Pritchard, L.S.
  • Acarnley, P.P.
  • Johnson, C.M.
Copyright, Publisher and Additional Information: Copyright © 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords: analytical model, die attach, finite element simulation, MOSFET, packaging, power semiconductor, solder layers, thermal conductivity, voids
  • Published: June 2004
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield)
Depositing User: Sherpa Assistant
Date Deposited: 12 Dec 2005
Last Modified: 04 Jun 2014 11:39
Published Version: http://dx.doi.org/10.1109/TCAPT.2004.828584
Status: Published
Refereed: Yes
Identification Number: https://doi.org/10.1109/TCAPT.2004.828584

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