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Novel sputtering-technology for grain-size control

Vopsaroiu, M, Thwaites, M J, Rand, S, Grundy, P J and O'Grady, K (2004) Novel sputtering-technology for grain-size control. IEEE Transactions on Magnetics. pp. 2443-2445. ISSN 1941-0069

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In this paper, we present a description of a novel high-rate plasma sputtering system that allows the control of grain size in sputtered films. Additionally, the system has the advantage of a better utilization of the target material (around 80% to 90%) by eliminating the race track at the target as in conventional plasma magnetron sputtering systems. The potential and capabilities of this novel plasma sputtering device are demonstrated in this paper by the deposition of a number of different Cr thin films suitable for underlayers in thin-film media and for which we have performed a systematic X-ray and TEM analysis to determine the grain-size histograms, mean grain diameters, and their relationship to the sputtering processes.

Item Type: Article
Copyright, Publisher and Additional Information: Copyright © 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords: Cr thin films,grain-size control,novel plasma sputtering,THIN-FILMS
Institution: The University of York
Academic Units: The University of York > Physics (York)
Depositing User: Sherpa Assistant
Date Deposited: 19 Sep 2005
Last Modified: 28 Jul 2016 06:16
Published Version: http://dx.doi.org/10.1109/TMAG.2004.828971
Status: Published
Refereed: Yes
URI: http://eprints.whiterose.ac.uk/id/eprint/651

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