Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Xiao, Y., Song, Z., Li, S. et al. (4 more authors) (2020) Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil. Materials Science and Engineering: A, 791. 139691. ISSN 0921-5093

Abstract

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Authors/Creators:
Copyright, Publisher and Additional Information: © 2020 Elsevier B.V. This is an author produced version of a paper subsequently published in Materials Science and Engineering: A. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/).
Keywords: Ultrafine grained Al alloy; Ni-foam/Sn composite solder; Ultrasonic soldering; Microstructure; Bonding mechanism
Dates:
  • Accepted: 31 May 2020
  • Published (online): 18 June 2020
  • Published: 22 July 2020
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield)
Funding Information:
FunderGrant number
ENGINEERING AND PHYSICAL SCIENCE RESEARCH COUNCILEP/S032169/1
Depositing User: Symplectic Sheffield
Date Deposited: 26 Jun 2020 14:12
Last Modified: 26 Jun 2020 14:12
Status: Published
Publisher: Elsevier BV
Refereed: Yes
Identification Number: https://doi.org/10.1016/j.msea.2020.139691

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Licence: CC-BY-NC-ND 4.0

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