Shi, Y., Wang, J.B. orcid.org/0000-0003-4870-3744 and Wang, B. (2021) Transient 3D lumped parameter and 3D FE thermal models of a PMASynRM under fault conditions with asymmetric temperature distribution. IEEE Transactions on Industrial Electronics, 68 (6). pp. 4623-4633. ISSN 0278-0046
Abstract
This paper proposes a novel transient 3D lumped-parameter (LP) thermal model and a 3D finite-element (FE) thermal model of a triple redundant 9-phase permanent magnet-assisted synchronous reluctance machine to predict the asymmetric temperature distribution under various fault conditions. Firstly, the predicted transient and steady-state temperatures are compared between the 3D LP and the 3D FE thermal models under fault conditions with uneven loss distribution. Also, the temperatures predicted by the LP and FE thermal models which account a number of practical issues are comprehensively compared with the test results under healthy and short-circuit fault conditions. The relative merits of the two thermal models are discussed. It is shown that both models have reasonable accuracy in predicting the machine thermal behavior under fault conditions and can be chosen according to the requirements.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. Reproduced in accordance with the publisher's self-archiving policy. |
Keywords: | Permanent magnet-assisted synchronous reluctance motor; lumped-parameter thermal model; 3D FE thermal model; fault tolerant; asymmetric temperature distribution |
Dates: |
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Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield) |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 30 Apr 2020 11:21 |
Last Modified: | 23 Nov 2021 12:50 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Refereed: | Yes |
Identification Number: | 10.1109/tie.2020.2988224 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:160083 |