Characterization of Cu-Sn SLID interconnects for harsh environment applications

Campos-Zatarain, A, Flynn, D, Aasmundtveit, KE et al. (6 more authors) (2014) Characterization of Cu-Sn SLID interconnects for harsh environment applications. In: DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. DTIP 2014, 02-04 Apr 2014, Côte d’Azur, France. IEEE . ISBN 9782355000287

Abstract

Metadata

Authors/Creators:
  • Campos-Zatarain, A
  • Flynn, D
  • Aasmundtveit, KE
  • Hoivik, N
  • Wang, K
  • Liu, H
  • Luu, TT
  • Mirgkizoudi, M
  • Kay, RW
Copyright, Publisher and Additional Information: (c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Keywords: "shake and bake"; SLID; high-temprature; Cu-Sn; harsh environment; bonding
Dates:
  • Published: 16 March 2014
Institution: The University of Leeds
Depositing User: Symplectic Publications
Date Deposited: 19 Mar 2018 14:30
Last Modified: 20 Mar 2018 04:54
Status: Published
Publisher: IEEE
Identification Number: https://doi.org/10.1109/DTIP.2014.7056665

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