Reliability Study and Modelling of IGBT Press-Pack Power Modules

Long, H.Y., Sweet, M.R., Narayanan, E.M.S. orcid.org/0000-0001-6832-1300 et al. (1 more author) (2017) Reliability Study and Modelling of IGBT Press-Pack Power Modules. In: Applied Power Electronics Conference and Exposition (APEC), 2017 IEEE. 2017 IEEE Applied Power Electronics Conference and Exposition (APEC 2017), 26-30 March 2017, Tampa Convention Center, Tampa, Florida. IEEE , pp. 2711-2717.

Abstract

Metadata

Authors/Creators:
Copyright, Publisher and Additional Information: © 2017 IEEE.
Keywords: IGBT; Power module; Press-pack; 3D FEM; circuit model
Dates:
  • Published (online): 18 May 2017
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield)
Funding Information:
FunderGrant number
INNOVATE UK (TSB)101535 (29118-212215)
Depositing User: Symplectic Sheffield
Date Deposited: 04 Aug 2017 09:54
Last Modified: 04 Aug 2017 10:02
Published Version: https://doi.org/10.1109/APEC.2017.7931082
Status: Published
Publisher: IEEE
Refereed: Yes
Identification Number: https://doi.org/10.1109/APEC.2017.7931082
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